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TST-107-01-G-D-03123
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TST-107-01-G-D-03
  • Manufacturer No:
    TST-107-01-G-D-03
  • Manufacturer:
    Samtec Inc.
  • Category:
    Rectangular Connectors - Headers, Male Pins
  • Datasheet:
    TST-107-01-G-D-03
  • SKU:
    3335723
  • Description:
    Conn Shrouded Header HDR 14 POS 2.54mm Solder ST Thru-Hole

TST-107-01-G-D-03 Details

Conn Shrouded Header HDR 14 POS 2.54mm Solder ST Thru-Hole

TST-107-01-G-D-03 Specification Parameters

  • Part Status: Active
  • IEC Conformance: NO
  • Mixed Contacts: NO
  • RoHS Status: ROHS3 Compliant
  • Number of Rows: 2
  • Mounting Type: Through Hole
  • Contact Finish - Mating: Gold
  • Termination: Solder
  • Factory Lead Time: 3 Weeks
  • Material Flammability Rating: UL94 V-0
  • Gender: Male
  • Fastening Type: Push-Pull
  • Max Current Rating: 3A
  • Contact Finish Thickness - Mating: 10.0μin 0.25μm
  • HTS Code: 8536.69.40.40
  • Orientation: Straight
  • Number of Positions: 14
  • Number of Positions Loaded: 13
  • Housing Material: Polyester
  • Current Rating (Amps): 3.4A per Contact
  • Insulation Material: Polybutylene Terephthalate (PBT), Glass Filled
  • Overall Contact Length: 0.480 12.19mm
  • Length: 22.86mm
  • Series: Flex Stack, TST
  • DIN Conformance: NO
  • Filter Feature: NO
  • MIL Conformance: NO
  • Moisture Sensitivity Level (MSL): 1 (Unlimited)
  • Packaging: Bulk
  • ECCN Code: EAR99
  • Insulation Color: Black
  • Operating Temperature: -55°C~125°C
  • Option: GENERAL PURPOSE
  • Pitch - Mating: 0.100 2.54mm
  • Contact Material: Phosphor Bronze
  • Contact Shape: Square
  • Contact Type: Male Pin
  • Row Spacing - Mating: 0.100 (2.54mm)
  • Connector Type: Header
  • Contact Finish Thickness - Post: 3.00μin 0.076μm
  • Shrouding: Shrouded - 4 Wall
  • Style: Board to Cable/Wire
  • Contact Length - Mating: 0.250 6.35mm
  • Feature: Keying Slot
  • Contact Length - Post: 0.115 2.92mm
  • Insulation Height: 0.350 8.89mm
  • Depth: 9.27mm
  • Additional Feature: SHROUDED, POLARIZED

Samtec Inc. — Manufacturer Introduction

Samtec Inc.
Samtec is a worldwide manufacturer of P.C. Board level interconnects. Samtec is a global manufacturer of a broad line of electronic interconnect solutions, including micro pitch board-to-board systems (on .100”, 2 mm, .050”, 1 mm, .8 mm, .635 mm, .5 mm, and .4 mm pitch), high-speed mezzanine systems, high-density arrays, IC-to-Board, Future-Proof/Active Optics, rugged/power systems, and cable assemblies (IDC, discrete wire, sealed/circulars, and high speed). To meet the interconnect challenges of tomorrow and beyond, Samtec has developed Technology Centers dedicated to developing and advancing technologies and products that provide both performance and cost benefits, ensuring complete system optimization from the bare die to an interface 100 meters away, and all interconnect points in between.

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